Thermal Analysis, TMA & Thermal Conductivity

Thermal transition, stability, degradation, heat capacity, cure behavior, dimensional stability, thermal expansion, thermal conductivity, and effusivity testing. Elect Nano uses this capability as part of application-driven materials programs where test setup, sample format, and data interpretation need to match the end-use requirement.

Capabilities

Thermogravimetric analysis up to 1000 C
Differential scanning calorimetry up to 725 C
Thermomechanical analysis and coefficient of thermal expansion measurement
Thermal conductivity and thermal effusivity testing
Moisture, volatile content, residue, filler loading, decomposition, and oxidative stability analysis
Thermal transition, crystallinity, heat capacity, cure, and photocalorimetry analysis

Equipment and Methods

TA Instruments Discovery TGA 550

Features

Thermogravimetric analysis up to 1000 C
High-resolution TGA and modulated TGA capabilities
Automated gas switching and purge control
Auto-sampler capability
Mass loss, decomposition onset, residue, filler content, moisture/volatile content, and oxidative stability analysis
Useful for polymers, composites, coatings, fillers, nanomaterials, and formulated systems

Accessories and configurations

Auto-sampler
Gas delivery manifold
Sample pans and calibration materials
TRIOS software

Applicable standards and internal methods

ASTM E1131: Compositional analysis by thermogravimetry
ASTM E2550: Thermal stability by thermogravimetry
ASTM D3850: Rapid thermal degradation of solid electrical insulating materials by thermogravimetry
ASTM D6370: Rubber compositional analysis by thermogravimetry
ISO 11358 series: Plastics thermogravimetry
Internal Method: Thermal stability, residue, filler loading, volatile content, and decomposition analysis workflows

TA Instruments Discovery DSC 2500

Features

Differential scanning calorimetry up to 725 C
Glass transition, melting, crystallization, enthalpy, heat capacity, cure, and thermal history analysis
Useful for thermoplastics, thermosets, adhesives, coatings, filled polymers, and composite materials
Supports UV-curable material studies when configured with photocalorimetry accessories
Supports sub-ambient thermal analysis when configured with compatible cooling systems

Accessories and configurations

Refrigerated cooling system for sub-ambient DSC testing
Photocalorimetry accessory for UV-curable materials
Tzero press
Tzero pans
Tzero hermetic lids
TRIOS software

Applicable standards and internal methods

ASTM D3418: Transition temperatures and enthalpies of fusion and crystallization of polymers by DSC
ASTM E1356: Assignment of glass transition temperatures by DSC
ASTM E1269: Determining specific heat capacity by DSC
ASTM E793: Enthalpies of fusion and crystallization by DSC
ASTM E794: Melting and crystallization temperatures by thermal analysis
ASTM E2160: Heat of reaction of thermally reactive materials by DSCAdapted where applicable to photocuring systems
ISO 11357 series: Plastics differential scanning calorimetry
Internal Method: DSC thermal transition, crystallinity, heat capacity, cure, and photocalorimetry workflows

TA Instruments TMA 450

Features

Thermomechanical analysis
Coefficient of thermal expansion measurement
Dimensional change versus temperature
Softening, penetration, expansion, shrinkage, and glass transition-related dimensional response
Useful for polymers, composites, coatings, films, molded parts, and filled systems

Accessories and configurations

Expansion probe configuration
Penetration probe configuration
Film/fiber probe configuration where available
Temperature-controlled TMA test configurations

Applicable standards and internal methods

ASTM E831: Linear thermal expansion of solid materials by thermomechanical analysis
ASTM E1545: Assignment of glass transition temperature by thermomechanical analysis
ASTM D696: Coefficient of linear thermal expansion of plastics between -30 C and 30 CRelated CTE method where applicable
ISO 11359 series: Plastics thermomechanical analysis
Internal Method: CTE, dimensional stability, softening, and penetration analysis workflows

C-Therm Trident

Features

Thermal conductivity testing
Thermal effusivity testing
Modified transient plane source measurement
Useful for polymers, composites, elastomers, coatings, foams, solids, pastes, and filled systems where compatible with sensor requirements
Supports heat-management material screening and comparative thermal performance studies

Accessories and configurations

MTPS sensor with Basic-k Module
Trident Platform Controller
Compatible sample holders and sensor interface configurations

Applicable standards and internal methods

ASTM D7984: Thermal conductivity of materials using a modified transient plane source method
ISO 22007-2: Determination of thermal conductivity and thermal diffusivity by transient plane heat source methodWhere applicable
Internal Method: Thermal conductivity and thermal effusivity screening workflows

Thermal Analysis, TMA & Thermal Conductivity

Capabilities

Equipment and Methods

TA Instruments Discovery TGA 550

TA Instruments Discovery DSC 2500

TA Instruments TMA 450

C-Therm Trident

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Discuss Thermal Analysis, TMA & Thermal Conductivity.