Electromagnetic management

Hard-level EMI shielding for conductive barriers, housings, and RF protection.

Hard-level EMI shielding is about creating a low-impedance conductive barrier that reflects and attenuates incident fields before they pass through the material. Elect Nano develops nanocarbon-enabled compounds, coatings, and hybrid filler systems for RF, microwave, mmWave, and lower-frequency electronics environments where conductivity, network continuity, thickness, frequency range, interface design, and part geometry all matter.

Interactive RF spectrum

3 kHz to 3 THz frequency bands

Log-scaled spectrum map with ITU band designations, IEEE radar-frequency bands, representative applications, and wavelength conversion.

Hover or tab through any band
ITU
IEEE
Wave
100 km3 kHz
10 km30 kHz
1 km300 kHz
100 m3 MHz
10 m30 MHz
1 m300 MHz
100 mm3 GHz
10 mm30 GHz
1 mm300 GHz
100 µm3 THz

Shielding physics

Hard shielding is measured by suppressed transmission.

Total shielding effectiveness, SET, is typically understood as the reduction in transmitted power through a material. It is often decomposed conceptually into reflection loss, absorption loss, and multiple-reflection effects.

Interactive shielding physics model

Total EMI shielding from complex material properties

Adjust conductivity, dielectric response, magnetic response, and thickness to estimate plane-wave shielding effectiveness from 30 kHz to 300 GHz. The model uses a lossy transmission-line slab calculation rather than a qualitative slider.

Slab modelεᵣ* = ε′ − j(ε′tanδ + σ/ωε₀)μᵣ* = 1 + (μₛ − 1)/(1 + jf/fᵣ)SET = −20 log₁₀ |T| for a finite layer in free space
0408012016030 kHz100 kHz1 MHz10 MHz100 MHz1 GHz10 GHz100 GHz300 GHzTotal shielding effectiveness, SET (dB)Frequency
1.73 GHzfrequency>220 dBsimulated SET17.3 cmwavelength41.8 µmclassical skin depth
980 kHz93.5 dBμ′ 25 / μ″ 0.20
994 MHz>220 dBμ′ 1.34 / μ″ 2.86
29.4 GHz>220 dBμ′ 1 / μ″ 0.098
300 GHz>220 dBμ′ 1 / μ″ 0.0096

Model boundaries

This is a normal-incidence, plane-wave, homogeneous-slab calculation in free space. It is useful for RF engineering intuition and material trade studies, but it does not include seams, apertures, cable penetrations, finite enclosure geometry, near-field source coupling, anisotropy, surface roughness, or manufacturing defects.

The magnetic response intentionally rolls off with frequency. Holding μ′ = 20–100 through microwave and mmWave bands would usually be unphysical for real ferrites or magnetic metal composites.

Traditional fillers

Conventional shielding fillers each carry a tradeoff.

Strong EMI shielding usually requires more than a conductive ingredient. Filler geometry, contact resistance, loading, density, processing, and corrosion or oxidation behavior determine whether the network survives real manufacturing.

FillerConductivityDensityCostProcessing noteBest-fit use
Silver flakeVery highHighVery highRheology-limited at high loadingThin high-frequency conductive coatings
Nickel powder or flakeModerateHighModerateLoading and oxidation sensitiveConductive systems needing magnetic contribution
Nickel-coated carbon fiberHigh when connectedModerateModerate to highFiber orientation and breakage sensitiveMolded compounds with aspect-ratio driven pathways
Stainless steel fiberLow to moderateHighModerateAbrasive and surface-finish sensitiveRugged shielding compounds
Nickel-plated graphiteModerate to highModerateModeratePlating and contact quality sensitiveGaskets and polymer systems
GraphiteLow to moderateLowLowOrientation and percolation sensitiveBroad conductive composites where cost matters

Selected filler

Silver flake

Strengths

  • + Very high conductivity
  • + Excellent high-frequency shielding
  • + Strong conductive network formation

Shortfalls

  • - High cost and density
  • - Tarnish or surface chemistry concerns
  • - Rheology and processing penalties at high loading

Primary design implication

Thin high-frequency conductive coatings. Evaluate this option against loading, contact resistance, part geometry, and the actual shielding frequency window.

Elect Nano approach

Nano-fillers can bridge the electrical gaps between larger fillers.

Elect Nano uses precision dispersed conductive nanofillers, including dCNTs and graphene-like nanocarbons, on their own or as hybrid additives with traditional conductive fillers.

Microfiller only

Large particles can leave electrical gaps.

Flakes, fibers, or powders may provide strong local conductivity, but hard shielding depends on whether those islands form a continuous network.

Nanofiller network

Nanoscale fillers can percolate at lower loading.

Carbon nanotubes and graphene-like structures can create distributed conductive pathways when dispersion quality is controlled.

Hybrid bridge

Nanofillers bridge microfiller contacts.

Hybrid systems use nanoscale conductors to fill electrical gaps between larger particles, lowering contact resistance and improving uniformity.

Frequency-dependent design

The right filler system changes with frequency.

Lower frequencies often need thicker conductive paths or magnetic permeability. RF, microwave, and mmWave shielding increasingly reward conductivity, network continuity, surface quality, and precision geometry.

1 to 30 GHz

Microwave

Surface currents dominate and thin, highly conductive barriers can provide strong shielding.

silver or hybrid fillershigh-aspect-ratio carbon networksthin-wall molded housings

Applications

Shielding failures often happen at interfaces, not only through the wall.

Bulk shielding performance matters, but seams, corners, fasteners, cables, joints, and discontinuities often determine whether the enclosure actually suppresses transmission.

Electronics housings and enclosures

RF and microwave modules

Spacecraft electronics and LEO components

Defense electronics

Telecom and 5G/6G hardware

Semiconductor process equipment

Cable shielding, connector housings, and backshells

Conductive coatings for plastic and composite parts

ESD + EMI multifunctional molded components

Gaskets, seams, interfaces, and enclosure leakage paths

Product platform

LCP Spectrum Silence™ is a molded polymer shielding platform.

LCP Spectrum Silence™ is a broadband EMI shielding nanocomposite injection molding compound engineered for high-frequency electronics, space hardware, RF systems, and precision molded components.

Broadband EMI shielding

High shielding per unit thickness

Thin-wall complex molded geometries

Lower density and lower thermal conductivity than metals

Magnetometer-friendly options where low magnetic remanence is needed

RF, microwave, mmWave, and electronics shielding applications

Open Product

Min

66.9

dB/mm

Average

77.1

dB/mm

Max

88.2

dB/mm

Values are thickness-normalized shielding effectiveness in dB/mm across 26.5 to 40 GHz using the Waveguide WR28 measurement set. Toggle total, absorbed, and reflected response to review how the shielding contribution changes with frequency.

Material sample review

Evaluate EMI Shielding for your application.

Share the performance target, process constraints, and use environment. Elect Nano can help define a practical evaluation plan.