Applications
Semiconductor fixturesHigh-temperature ESD componentsElectronics handling hardwareWear-resistant molded tools
ESD-Safe Materials
High-temperature low-particle ESD
MPPO LP ESD TGF30
MPPO LP ESD TGF30 is a high-temperature polyphenylene oxide injection molding compound reinforced with 30 wt% thin glass fiber. It uses dCNT technology to improve electrical uniformity across molded specimens while the thin-fiber package supports low particle sloughing, good surface finish, wear resistance, laser marking contrast, low warpage, and tighter molding tolerances.
Properties
| Property | Value | Method or Context |
|---|---|---|
| Surface resistance | 1E+08 ohm | ANSI STM11.11 |
| Density | 1.34 g/cm3 | ASTM D792 |
| Tensile strength | 72 MPa | ASTM D638 |
| Tensile modulus | 9.1 GPa | ASTM D638 |
| Flexural strength | 144 MPa | ASTM D790 |
| Heat deflection temperature | 177 C | 1.82 MPa |
Usage Guide
Processing
- Dry to less than 200 ppm moisture before molding.
- Typical melt temperature window: 300-325 C.
Qualification
- Useful when the application needs higher thermal performance than COC-based ESD compounds.
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